My research

From LinksWiki

My work so far has focused on interconnect and communication in digital systems. In the past, I have worked with E.J. Kim and K.H. Yum on low energy Infiniband-compatible system interconnects. In that work, I designed and layed out a 70nm Infiniband-compatible router, and used HSPICE to characterize it's energy and performance under different loads.

In the past, my work focused on the interconnect found in Network-On-Chip designs (NoC), where multiple processing elements are connected on the same die via a very small packet-based switching network. I have designed and synthesized a number of different on-chip packet routers to characterize their performance and energy behaviours, allowing a more informed analysis of network topologies and characteristics. Recently, I worked on fault-tolerance in NoC, trying to develop a self-aware network infrastructure that can determine its own faults, and adapt to them.

Currently, I'm working on thermal aware design, especially as regards to the 3D integrated circuit space. I've got a 3-Dimensional compact thermal modeler up and running (self-modified version of HotSpot, from the University of Virginia), and am using it in a number of projects, ranging from a thermal-aware placer, to heat-optimized adder designs.

My dissertation topic is Temperature-Adaptive Computing, where I'm exploring the impact of temperature on modern design processes, and working on optimized architectures to avoid problems. If you're interested in my research, feel free to contact me using my Contact_Information.